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2UUL BG03 0.12mm CPU BGA Reballing Stencil for iPhone 17 Series

SKU: EDA0089904
Sale Sold out Pre-order
Regular price R 199.00
Regular price Sale price R 199.00
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Processing time: 1-3 days

Description

The 2UUL BG03 0.12mm CPU BGA Reballing Stencil is a specialized tool for CPU BGA reballing applications. It is designed for professional technicians to improve the efficiency of CPU BGA chip replacement and repair.

  • Product Type: BGA Stencils
  • Brand: 2UUL
  • Compatibility: iPhone 17 Series
  • Material: Nickel-plated steel
  • Precision: 0.12mm pinholes
  • Durability: Wear-resistant, heat-resistant, deformation-free
  • Intended Use: Professional repair
  • Enhances soldering efficiency by minimizing solder ball displacement
  • Improves soldering success rates with precise solder ball placement
  • Designed for technicians and professional repair shops

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